Adhesives Technology for Electronic Applications: Materials, by James J. Licari,Dale W. Swanson

By James J. Licari,Dale W. Swanson

This publication is exclusive in its accomplished insurance of all features of adhesive expertise for microelectronic units and packaging, from concept to bonding to check techniques. as well as normal purposes, resembling dies, substrate, and lid and chip stack attachments, the ebook comprises new advancements in anisotropic, electrically conductive, and underfill adhesives. quick curing equipment similar to UV, microwave, and moisture (which conform to present environmental and effort specifications) are coated. Over eighty tables and a hundred and twenty figures offer a wealth of knowledge on homes, functionality, and reliability. additionally integrated are examples of commercially to be had adhesives, providers, and kit. every one bankruptcy offers entire references.

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